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Specifications

Important

Unless otherwise stated, all specifications apply after 30 minutes of instrument warm-up.

For measurements in which high gate fidelity is crucial, it is highly recommended to enable all required outputs and inputs and wait for 2 hours after powering on the instrument.

Important

Important changes in the specification parameters are explicitly mentioned in the revision history of this document.

General Specifications

Table 1: General and storage
Parameter Min Typ Max
storage temperature –25 °C - 65 °C
storage relative humidity (non-condensing) - - 95%
operating temperature 5 °C - 40 °C
operating relative humidity (non-condensing) - - 90%
specification temperature 18 °C - 28 °C
power consumption - - 300 W
operating environment IEC61010, indoor location, installation category II, pollution degree 2    
operating altitude up to 2000 meters    
power inlet fuses 250 V, 2 A, fast acting, 5 x 20 mm    
power supply AC line 100-240 V (±10%), 50/60 Hz    
dimensions (width x depth x height) 45.0 × 39.7 × 13.2 cm (no handle), 17.7 × 15.6 × 5.2 inch, 19 inch rack compatible    
weight 15 kg (33 lb)    
recommended calibration interval 2 years    
Table 2: Maximum ratings
Parameter Min Typ Max
damage threshold Out - - +30 dBm
damage threshold In - - +20 dBm
damage threshold Mark Out –0.7 V - +4 V
damage threshold Trig In (1 kΩ input impedance) –11 V - +11 V
damage threshold Trig In (50 Ω input impedance) –6 V - +6 V
damage threshold Aux In (DC) -10 V - +10 V
damage threshold Aux In (AC) - - +20 dBm
damage threshold External Clk In (DC) –3 V - +3 V
damage threshold External Clk In (AC, with DC offset 0 V) - - +13.5 dBm
damage threshold External Clk Out (DC) –3 V - +3 V
MDS In / Out –0.7 V - +4 V
DIO In / Out in default configuration 3.3 V CMOS/TTL –0.7 V - +4 V
torque limit front panel SMA connectors - - 0.5 Nm
torque limit back panel SMA connectors - - 1.0 Nm
Table 3: Host computer requirements
Parameter Description
supported Windows operating systems Windows 10, 11 on x86-64
supported macOS operating systems macOS 10.11+ on x86-64 and ARMv8
supported Linux distributions GNU/Linux (Ubuntu 14.04+, CentOS 7+, Debian 8+) on x86-64 and ARMv8
supported processors x86-64 (Intel, AMD), ARMv8 (e.g., Raspberry Pi 4 and newer, Apple M-series)

Analog Interface Specifications

Table 4: Signal Outputs
ParameterDetailsMinTypMax
connectors-SMA, front panel single-ended
impedance--50 Ω-
couplingLF pathDC
RF pathAC
synthesizersQuantum Analyzer channelOne per channel
shared with Signal Input of the same Channel
Signal Generator channelsOne per channel pair
synthesizer frequency rangeQuantum Analyzer channel1-8 GHz
Signal Generator channels0.6-8 GHz
instantaneous bandwidth (–3dB)RF path±500 MHz
LF path, Quantum Analyzer channelDC - 800 MHz
LF path, Signal Generator channelsDC - 2500 MHz
total frequency rangeDC-8.5 GHz
rangeRF path, into 50 Ω-30 dBm-+10 dBm
LF path, into 50 Ω-30 dBm-+5 dBm
output level accuracyinto 50 Ω-±(1 dBm of setting)-
output level temperature driftdirect-0.15 dB/°C-
when looped with Signal Input-0.25 dB/°C-
D/A converter vertical resolution-14 bit
D/A converter sampling rateafter internal x3 interpolation6 GSa/s
voltage spectral noise densityRF path, 10 dBm range--143 dBm/Hz-
phase noiseRF path, 5 GHz, 10 kHz offset frequency--110 dBc/Hz-
RF path, 5 GHz, 10 MHz offset frequency--138 dBc/Hz-
spurious free dynamic range (excluding harmonics)RF path, 10 dBm range,
CW tone, signal amplitude 10 dBm (0 dBFS)
-48 dBc-
worst harmonic component10 dBm range1 GHz --40 dBc-
4 GHz --40 dBc-
6 GHz --38 dBc-
8 GHz --36 dBc-
Table 5: Time Domain Output Characteristics
ParameterDetailsMinTypMax
skew adjustment resolutionQuantum Analyzer channel2 ns
Signal Generator channels500 ps
Table 6: Signal Inputs
ParameterDetailsMinTypMax
connectors-SMA, front panel single-ended
impedance--50 Ω-
couplingRF pathAC
synthesizers-One per channel
shared with Signal Output of the same Channel
synthesizer frequency range-1-8 GHz
instantaneous bandwidth (–3dB)RF path±500 MHz
LF pathDC - 800 MHz
total frequency range-DC-8.5 GHz
rangeRF path, into 50 Ω-50 dBm-+10 dBm
LF path, into 50 Ω-30 dBm-+10 dBm
input level accuracy at carrier frequency and 23°C≤1 Vpp and <4 GHz-± 0.5 dB-
≤1 Vpp and <8 GHz-± 1 dB-
>8 GHz-± 3 dB-
input level temperature driftdirect-0.15 dB/C-
when looped with Signal Output-0.25 dB/C-
A/D converter vertical resolution-14 bit
A/D converter sampling ratebefore internal x2 decimation4 GSa/s
voltage noise densityin-band noise measured with room-temperature 50 Ω cap, 1 GHz 10 dBm--130 dBm/Hz (71 nV/√Hz)-
0 dBm--134 dBm/Hz (45 nV/√Hz)-
-10 dBm--145 dBm/Hz (13 nV/√Hz)-
-20 dBm--142 dBm/Hz (18 nV/√Hz)-
-30 dBm--162 dBm/Hz (1.78 nV/√Hz)-
-40 dBm--165 dBm/Hz (1.26 nV/√Hz)-
-50 dBm--166 dBm/Hz (1.12 nV/√Hz)-
spurious free dynamic range (excluding harmonics)signal at center frequency, max. amplitude, -750 to 750 MHz 10 dBm-54 dBc-
0 dBm-54 dBc-
-10 dBm-55 dBc-
-20 dBm-50 dBc-
-30 dBm-58 dBc-
-40 dBm-53 dBc-
-50 dBm-45 dBc-
3rd order intermodulation distortiondual tone with -7 dBFS of range with 150 MHz Splitting from 1 GHz to 8 GHz 10 dBm-45 dBc-
0 dBm-54 dBc-
-10 dBm-54 dBc-
-20 dBm-56 dBc-
-30 dBm-54 dBc-
-40 dBm-50 dBc-
-50 dBm-40 dBc-
Table 7: Marker Outputs & Trigger Inputs
ParameterDetailsMinTypMax
marker outputsQuantum Analyzer channel2
Signal Generator channels1 per channel 
marker outputs connector-SMA, front panel single-ended
marker output high voltage--3.3 V-
marker output low voltage--0 V-
marker output impedance--50 Ω-
marker output rise time 20% to 80%--300 ps-
trigger inputsQuantum Analyzer channel2
Signal Generator channels1 per channel
trigger inputs connector-SMA, front panel single-ended
trigger input impedance-50 Ω / 1 kΩ
trigger input voltage range50 Ω impedance–5 V-5 V
1 kΩ impedance–10 V-10 V
trigger input threshold range50 Ω impedance–5 V-5 V
1 kΩ impedance–10 V-10 V
trigger input threshold resolution--< 0.4 mV-
trigger input threshold hysteresis--> 60 mV-
Table 8: Other Inputs and Outputs
Parameter Details min Typ Max
reference clock input - SMA on back panel    
reference clock input impedance - 50 Ω, AC coupled    
reference clock input frequency - 10 / 100 MHz    
reference clock input amplitude 10 MHz -4 dBm - +13 dBm
  100 MHz –5 dBm - +13 dBm
reference clock output - SMA on back panel    
reference clock output impedance 50 Ω, AC coupled    
reference clock output amplitude into 50 Ω 2 Vpp - 5 Vpp
reference clock output frequency 10/100 MHz    
reference clock output jitter derived from integrated phase noise measurement (12 kHz to 20 MHz offset frequency) - 280 fs RMS -
Table 9: Oscillator and Clocks
Parameter Details Min Typ Max
internal clock type - OCXO    
internal clock long term accuracy / aging - - - ±0.3 ppm/year
internal clock short term stability (1 s) - - - ±0.05 ppm
internal clock initial accuracy - - - ±0.5 ppm
internal clock temperature stability –20°C to 70°C - - ±0.5 ppm
internal clock phase noise offset 100 Hz - –135 dBc/Hz -
  offset 1 kHz - –157 dBc/Hz -

Digital Waveform Generation of Signal Generator Channel

Table 10: Waveform Generation
Parameter Details Specification
number of AWG cores for SHFQC+ base version 1 per channel
  for SHFQC+ with SHFQC-RTR 6 total
AWG sampling rate dual-channel 2 GSa/s
waveform memory per output channel - 96 kSa 1
sequence length - 32 kInstructions instructions per core 2
waveform granularity - 16 samples
minimum waveform length - 16 samples (with command table)
sequencer clock frequency - 250 MHz

Digital Signal Processing of Quantum Analyzer Channel

Table 11: Readout Pulse Generator
Parameter Details Specification
number of readout pulse generators - 1
waveform memory per channel for SHFQC+ base version 32 kSa total memory,
8 memory blocks with 4 kSa for arbitrary waveform storage,
freely configurable and triggerable 1
  for SHFQC+ with SHFQC-16W 64 kSa total memory,
16 memory blocks with 4 kSa for arbitrary waveform storage,
freely configurable and triggerable 1
sequence length - 16 kInstructions instructions 2
waveform granularity - 4 samples
minimum waveform length - 4 samples
sequencer clock frequency - 250 MHz
Table 12: Qubit Measurement Unit
Parameter Details Specification
number of Qubit Measurement Units - 1
number of integration weights of Qubit Measurement Unit for SHFQC+ base version 8
  for SHFQC+ with SHFQC-16W 16
integration weight time resolution - 0.5 ns
integration weight length - 4 kSa 1
minimum weight length - 4 samples
integration weight granularity - 4 samples
multistate discrimination - yes
number of distinguishable states - up to 4
Table 13: Scope and Trigger Engine
Parameter Details Specification
Scope memory 64 kSa 1
  max. averages 2^16

Digital Interface Specifications

Table 14: Digital Interfaces
Parameter Description
host computer connection USB 3.0, 1.6 Gbit/s (1 communication, 1 maintenance)
  1GbE, LAN / Ethernet, 1 Gbit/s
DIO port 4 x 8 bit, general purpose digital input/output port, 3.3 V TTL specification
ZSync peripheral port connector for ZI proprietary bus to communicate with external peripherals

DIO Port

The DIO port is a VHDCI 68 pin connector as introduced by the SPI-3 document of the SCSI-3 specification. It is a female connector that requires a 32 mm wide male connector. The interface standard is switchable between LVDS (low-voltage differential signalling) and LVCMOS/LVTTL. The DIO port features 32 user-controlled bits that can all be configured byte-wise as inputs or outputs in LVCMOS/LVTTL mode, whereas in LVDS mode, half of the bits are always configured as inputs. For more specifics on how the user-definable pins can be set.

Figure 1: DIO HD 68 pin connector

Table 15: Electrical Specifications
Parameter Details Min Typ Max
supported DIO interface standards - LVCMOS/LVTTL (single-ended, 3.3 V); LVDS (differential)    
high-level input voltage VIH LVCMOS/LVTTL 2.0 V - -
low-level input voltage VIL LVCMOS/LVTTL - - 0.8 V
high-level output voltage VOH LVCMOS/LVTTL
at IOH < 12 mA
2.6 V - -
low-level output voltage VOL LVCMOS/LVTTL
at IOL < 12 mA
- - 0.4 V
high-level output current IOH (sourcing) LVCMOS/LVTTL - - 12 mA
low-level output current IOL (sinking) LVCMOS/LVTTL - - 12 mA
input differential voltage VID LVDS 100 mV - 600 mV
input common-mode voltage VICM LVDS 0.3 V - 2.35 V
output differential voltage VOD LVDS 247 mV - 454 mV
output common-mode voltage VOCM LVDS 1.125 V - 1.375 V
Table 16: DIO Pin Assignment in LVCMOS/LVTTL Mode
Pin Name Description
68 CLKI digital input
67 unused leave unconnected
66 .. 59 DIO[31:24] digital input or output byte (set by user)
58 .. 51 DIO[23:16] digital input or output byte (set by user)
50 .. 43 DIO[15:8] digital input or output byte (set by user)
42 .. 35 DIO[7:0] digital input or output byte (set by user)
34 GND digital ground
33 unused leave unconnected
32 .. 1 GND digital ground
Table 17: DIO Pin Assignment in LVDS Mode
Pin Name Description
68 CLKI+ digital input
67 unused leave unconnected
66 .. 59 DI+[31:24] digital input byte
58 .. 51 DI+[23:16] digital input byte
50 .. 43 DIO+[15:8] digital input or output byte (set by user)
42 .. 35 DIO+[7:0] digital input or output byte (set by user)
34 CLKI– digital input
33 unused leave unconnected
32 .. 25 DI–[31:24] digital input byte
24 .. 17 DI–[23:16] digital input byte
16 .. 9 DIO–[15:8] digital input or output byte (set by user)
8 .. 1 DIO–[7:0] digital input or output byte (set by user)

  1. With binary prefix: 1 kSa = 1024 Sa 

  2. With binary prefix: 1 kInstructions = 1024 Instructions